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Key Responsibilities:
•    Own FA pipeline for NPI and MP builds
•    Take ownership of failed units once CM NPI/MP yield reports are released; prioritize based on yield and customer impact.
•    Triage failures, classify by failure type (HW, test, process, system), and coordinate board movement and tracking.
•    Execute standard FA flow: visual inspection, repro of failure, electrical characterization, and isolation to device/board/test/process root cause.
•    Use tools such as MODS/diags, shmoos (voltage/frequency/temperature), floor-sweeping of GPU resources, voltage margining, packet and link‑level debug, etc., to characterize intermittent and marginalities.
•    Prepare and execute debug experiments on host systems (remote access, scripting, automation) to reproduce and narrow failure signatures.
•    File and manage NV bugs in the correct modules (e.g., BoardOps, BrdSoln) for every HW failure, with clear symptom, conditions, logs, and suspected scope.
•    Own bug lifecycle: driving reproducer clarity, experiments, and data needed by PDE/design, closing with well‑documented root cause and corrective action.
•    Partner with PDE, design, test, quality, CM test/FXN, and component vendors to converge root cause and implement robust fixes in design, test content, or process.
•    Provide FA input to FRR / factory readiness, test plans, and manufacturing control plans so that known risks are screened at scale.
•    Summarize FA learnings into Pareto, yield detractors, and systemic issue patterns for PE/PDE and Ops leadership.
•    Recommend and help implement improvements: test limits, new screens, process changes, design ECOs, and alternative components where appropriate.

Qualifications & Skills
•    BS/MS in Electrical Engineering, Computer Engineering, Physics, or related field.
•    Experience in board/system debug, semiconductor test, or product/FA engineering (NPI and/or HVM) strongly preferred
•    Strong understanding of digital/SoC/GPU boards, power, high‑speed interfaces, and manufacturing test flows.
•    Hands‑on experience with lab tools (scope, DMM, logic analyzer, JTAG, boundary scan) and factory diagnostics / MODS / burn‑in / stress tests.
•    Ability to read schematics, BOMs, and layout, and correlate to failure signatures.
•    Comfortable with Linux command line, scripting (e.g., Python/Perl), and remote lab access tools for automation and data extraction.

Soft Skills:
•    Strong root‑cause thinking, able to design experiments that separate board vs. silicon vs. test vs. process issues.
•    Clear written and verbal communication for cross‑site teams, including concise FA summaries for executives and design owners.
•    Ability to manage multiple FA tasks in parallel, prioritize by yield/customer impact, and work closely with CMs under tight build schedules.