Camera Engineer
| Key Qualifications ● Over 7 years of hands-on experience in semiconductor IC or module packaging, especially on Camera Module or related processes. ● Process technology knowledge in SMT and advanced IC / camera module packaging areas ● Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active Alignment Process & etc. ● Experienced working with subcontract manufacturing partners. ● High volume manufacturing, and production ramp experience. ● Knowledgeable in production control processes, machine commissioning, data analysis/interpretation GR&R, Cp/Cpk and correlation analysis ● Fluent in English communication, additional language skills a plus. ● Demonstrated ability to perform DOE, data analysis, SPC control. ● Demonstrated failure mode analysis, root cause investigation, and problem solving for product yield and quality issue. ● Project Management- Excellent data handling, documentation, critical milestone creation, and organization skill ● Strong collaboration skill to work with diversified x-function team. Description ● Develop Camera Module assembly process / equipment / materials for FOL (Front of Line) and EOL (End of Line) - Develop new assembly process / equipment / material for Camera module related components - Provide technical leadership in resolving any process issues - Responsible for developing DOEs, Statistical Process Analysis, Process Specification, D/PFMEA and Process control plan - Responsible for Failure analysis, Corrective actions and Yield improvement ● Process technology feasibility studies through theoretical simulation and/or practical engineering methods Process Development - Leads design and development of technically complex manufacturing processes including material selection, parameter optimization, equipment, metrology, and system design to enable new products designs & functional requirements. ● Develop Process for Manufacturability - Provide early and ongoing manufacturing leadership to ensure new process is scalable for high volume Process FMEA - Lead PFMEA generation for new process technology Failure Analysis - Lead root cause analysis and metrology development for issues related to new process technology. ● Supporting complex, high volume camera module modules. Provide leadership in the areas of module construction, materials, equipment, and processes. ● Identify the correct product process flow, compatible with high volume manufacturing requirements. Work to develop key and new process/equipment/material for camera module. Participate in external vendor assessment and selection, from MP intent equipment, process, to direct and indirect materials. Responsible for DOE planning, statistical process analysis, process specification, and D/PFMEA. Education & Experience B.S. degree in Engineering (Mechanical, Electronics, Electrical, Physics, or equivalent) |
Experience: 5-8 Years .
The expected compensation for this role ranges from $60,000 to $135,000 .
Final compensation will depend on various factors, including your geographical location, minimum wage obligations, skills, and relevant experience. Based on the position, the role is also eligible for Wipro's standard benefits including a full range of medical and dental benefits options, disability insurance, paid time off (inclusive of sick leave), other paid and unpaid leave options.
Applicants are advised that employment in some roles may be conditioned on successful completion of a post-offer drug screening, subject to applicable state law.
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